With the continuous upgrading of AI demand, high-performance AI server power supplies will be the focus of future demand, regardless of the evolution direction of computing power and energy efficiency. With the increasing energy consumption of AI chips and the evolution trend of small size and high power of power modules, the increasing demand for PCB technology of power modules has brought opportunities and challenges to us.
Embedment: In order to achieve smaller size and volume, some devices need to be embedded in the PCB board. At present, the main forms are PCB advanced packaging forms of embedded magnetic materials, embedded inductors, embedded capacitors, and embedded chips.
Modularization: The power module has changed from the original pin welding method to the LGA/BGA patch method. The number of PCB board requirements has also changed from 1pcs to the current 2-3pcs, and PCB has been added to replace system connector products.
High frequency: The high frequency of power modules mainly requires PCB technology, including thinning of dielectric thickness, increase of CCL copper thickness, and improvement of voltage resistance and leakage performance. For example: the thickness of a 30-layer 2oz product is only 3.5mm.
Chipization: PCB products are plastic-sealed after PCBA assembly, and then the surface of the plastic-sealed material is designed with graphics. Metallization packaging technology requirements.
PCBPro.online Co. Ltd is a leading supplier of high-quality end-to-end printed circuit boards for the power supply industry. Based on the demand for power supply PCB products, we increase R&D investment, improve processing capabilities, and provide comprehensive solutions, including various services and technologies, to meet the diverse needs of customers.
